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Teledyne LeCroy – Live Technical Webinars

2019-06-06  |  News

 

 



DisplayPort Compliance Test Overview

Part 1: PHY Compliance Testing for DP1.4 and Beyond



As DisplayPort developers continue to deploy DP1.4 designs at HBR3-8.1Gb/s, and look forward to Ultra High Bit Rates (UHBR) up to 20Gb/s over the USB-C connector; testing becomes more complex with each generation of DisplayPort Sources, Sinks, and Cables. This two-part webinar will cover all aspects of testing DisplayPort designs from the only company that covers all the required compliance tests – for both Physical (PHY) Layer and all Protocol layers.


Teledyne LeCroy’s DisplayPort physical-layer and protocol test experts will break down each test, explaining the background theory, how the test procedure works, how passes and failures are determined, and how to track down and debug problems.


Part 1 will cover PHY Testing , Part 2 will cover Link Layer and Functional Testing.


Presenter: Mike Engbretson, Oscilloscope Product Marketing Manager


Title

DisplayPort Compliance Test Overview Part 1: PHY Compliance Testing for DP1.4 and Beyond

Date

Wed, Sept 18

Time

2:00 PM EST

Register




DisplayPort Compliance Test Overview

Part 2: Protocol Compliance Testing for DP1.4



As DisplayPort developers continue to deploy DP1.4 designs at HBR3-8.1Gb/s, and look forward to Ultra High Bit Rates (UHBR) up to 20Gb/s over the USB-C connector; testing becomes more complex with each generation of DisplayPort Sources, Sinks, and Cables. This two-part webinar will cover all aspects of testing DisplayPort designs from the only company that covers all the required compliance tests – for both Physical (PHY) Layer and all Protocol layers.


Teledyne LeCroy’s DisplayPort physical-layer and protocol test experts will break down each test, explaining the background theory, how the test procedure works, how passes and failures are determined, and how to track down and debug problems.


In Part 2, we cover a broad range of DisplayPort protocol compliance tests for both sources and sinks. These include Link Layer, Forward Error Correction (FEC), Display Stream Compression (DSC) and High-bandwidth Digital Content Protection (HDCP) compliance tests.


Presenter: Neal Kendall, Video Analyzer Marketing Manager


Title

DisplayPort Compliance Test Overview Part 2: Protocol Compliance Testing for DP1.4

Date

Wed, Sept 25

Time

2:00 PM EST

Register




Differential Impedance Webinar: How Not to Be Confused



Differential pairs proliferate in all high-speed interconnects. While many of the principles of single-ended interconnects can be applied to differential signals and interconnects, there are a few special considerations that are different.


In this webinar, we explore how to think about differential and common impedance. Based on the properties of a differential pair, we look at using a two port TDR as a differential TDR so we can characterize the basic differential impedance properties of the interconnect. We look at a variety of examples of differential traces on circuit boards and cables.


Presenter: Eric Bogatin, Dean of the Signal Integrity Academy


Title

Differential Impedance Webinar: How Not to Be Confused

Date

Wed, Oct 2

Time

2:00 PM EST

Register




Probing in Power Electronics - What to Use and Why

Two Part Webinar Series - Part 1



Power electronics designs have inherent measurement challenges. This has led to development of many specialized high and low voltage single-ended and differential probes to meet the specific needs of this market. However, proper probe selection and use is critical for operator, equipment and DUT safety and also has a large influence on the accuracy of the measurement.


Join Teledyne LeCroy for this two-part webinar series as we provide an overview of the different HV rated probe specifications and topologies, explain what measurement each probe topology is ideally suited for, and provide real-word examples and comparisons between a variety of different probes and amplifiers.


Part 1 will provide an essential overview of probe specifications, probe types and characteristics, and probe fit to various applications, and the first of several real-world probe measurement comparisons.


Presenter: Ken Johnson, Director of Marketing, Product Architect Teledyne LeCroy


Title

Probing in Power Electronics - What to Use and Why Two Part Webinar Series - Part 1

Date

Wed, Oct 23

Time

2:00 PM EST

Register




Probing in Power Electronics - What to Use and Why

Two Part Webinar Series - Part 2



Power electronics designs have inherent measurement challenges. This has led to development of many specialized high and low voltage single-ended and differential probes to meet the specific needs of this market. However, proper probe selection and use is critical for operator, equipment and DUT safety and also has a large influence on the accuracy of the measurement.


Join Teledyne LeCroy for this two-part webinar series as we provide an overview of the different HV rated probe specifications and topologies, explain what measurement each probe topology is ideally suited for, and provide real-word examples and comparisons between a variety of different probes and amplifiers.


Part 2 will continue with additional real-world probe measurement comparisons.


Presenter: Ken Johnson, Director of Marketing, Product Architect Teledyne LeCroy


Title

Probing in Power Electronics - What to Use and Why Two Part Webinar Series - Part 2

Date

Wed, Oct 30

Time

2:00 PM EST

Register




Lossy Interconnects and Insertion Loss



This is the third webinar in our six-part High Speed Interconnect Characterization webinar series.


Losses play a dominant role in all high-speed serial interconnects. We see these effects in the time domain by the rising reflected TDR response and increased rise time of transmitted signals. These are due to frequency dependent losses, which are more easily characterized in the frequency domain.


In this webinar, we will look at how to interpret the measurements of single-ended and differential S-parameters in terms of the frequency dependent losses of the interconnect and the impact of these losses in the TDR response.


Presenter: Eric Bogatin, Dean of the Signal Integrity Academy


Title

Lossy Interconnects and Insertion Loss

Date

Wed, Nov 6

Time

2:00 PM EST

Register







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